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PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
Rev. 05 -- 19 March 2010 Product data sheet
1. General description
The PCA9306 is a dual bidirectional I2C-bus and SMBus voltage-level translator with an enable (EN) input, and is operational from 1.0 V to 3.6 V (Vref(1)) and 1.8 V to 5.5 V (Vbias(ref)(2)). The PCA9306 allows bidirectional voltage translations between 1.0 V and 5 V without the use of a direction pin. The low ON-state resistance (Ron) of the switch allows connections to be made with minimal propagation delay. When EN is HIGH, the translator switch is on, and the SCL1 and SDA1 I/O are connected to the SCL2 and SDA2 I/O, respectively, allowing bidirectional data flow between ports. When EN is LOW, the translator switch is off, and a high-impedance state exists between ports. The PCA9306 is not a bus buffer like the PCA9509 or PCA9517A that provide both level translation and physically isolates the capacitance to either side of the bus when both sides are connected. The PCA9306 only isolates both sides when the device is disabled and provides voltage level translation when active. The PCA9306 can also be used to run two buses, one at 400 kHz operating frequency and the other at 100 kHz operating frequency. If the two buses are operating at different frequencies, the 100 kHz bus must be isolated when the 400 kHz operation of the other bus is required. If the master is running at 400 kHz, the maximum system operating frequency may be less than 400 kHz because of the delays added by the translator. As with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH levels on the translator's bus. The PCA9306 has a standard open-collector configuration of the I2C-bus. The size of these pull-up resistors depends on the system, but each side of the translator must have a pull-up resistor. The device is designed to work with Standard-mode, Fast-mode and Fast mode Plus I2C-bus devices in addition to SMBus devices. The maximum frequency is dependent on the RC time constant, but generally supports > 2 MHz. When the SDA1 or SDA2 port is LOW, the clamp is in the ON-state and a low resistance connection exists between the SDA1 and SDA2 ports. Assuming the higher voltage is on the SDA2 port when the SDA2 port is HIGH, the voltage on the SDA1 port is limited to the voltage set by VREF1. When the SDA1 port is HIGH, the SDA2 port is pulled to the drain pull-up supply voltage (Vpu(D)) by the pull-up resistors. This functionality allows a seamless translation between higher and lower voltages selected by the user without the need for directional control. The SCL1/SCL2 channel also functions as the SDA1/SDA2 channel.
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
All channels have the same electrical characteristics and there is minimal deviation from one output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage translation solutions, since the fabrication of the switch is symmetrical. The translator provides excellent ESD protection to lower voltage devices, and at the same time protects less ESD-resistant devices.
2. Features
2-bit bidirectional translator for SDA and SCL lines in mixed-mode I2C-bus applications Standard-mode, Fast-mode, and Fast-mode Plus I2C-bus and SMBus compatible Less than 1.5 ns maximum propagation delay to accommodate Standard mode and Fast mode I2C-bus devices and multiple masters Allows voltage level translation between: 1.0 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) 1.2 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) 1.8 V Vref(1) and 3.3 V or 5 V Vbias(ref)(2) 2.5 V Vref(1) and 5 V Vbias(ref)(2) 3.3 V Vref(1) and 5 V Vbias(ref)(2) Provides bidirectional voltage translation with no direction pin Low 3.5 ON-state connection between input and output ports provides less signal distortion Open-drain I2C-bus I/O ports (SCL1, SDA1, SCL2 and SDA2) 5 V tolerant I2C-bus I/O ports to support mixed-mode signal operation High-impedance SCL1, SDA1, SCL2 and SDA2 pins for EN = LOW Lock-up free operation Flow through pinout for ease of printed-circuit board trace routing ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 Packages offered: SO8, TSSOP8, VSSOP8, XQFN8, XSON8, XSON8U
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
2 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
3. Ordering information
Table 1. Ordering information Tamb = -40 C to +85 C. Type number PCA9306D PCA9306DP PCA9306DC PCA9306DP1[2] PCA9306DC1[3] PCA9306GD1[4] PCA9306GM PCA9306GF Topside mark PCA9306 306P 306C 306T P06 P06 P6X[5] 06 Package Name SO8 TSSOP8[1] VSSOP8 TSSOP8 VSSOP8 XSON8U XQFN8 XSON8 Description plastic small outline package; 8 leads; body width 3.9 mm plastic thin shrink small outline package; 8 leads; body width 3 mm plastic very thin shrink small outline package; 8 leads; body width 2.3 mm plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm plastic very thin shrink small outline package; 8 leads; body width 2.3 mm plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm Version SOT96-1 SOT505-1 SOT765-1 SOT505-2 SOT765-1 SOT996-2 SOT902-1 SOT1089
[1] [2] [3] [4] [5]
Also known as MSOP8. Same footprint and pinout as the Texas Instruments PCA9306DCT. Same footprint and pinout as the Texas Instruments PCA9306DCU. Low cost, thinner, drop-in replacement for VSSOP8 (SOT765-1) package. `X' will change based on date code.
4. Functional diagram
VREF1 2 VREF2 7 8 6 EN SCL2
PCA9306
SCL1 3 SW
SDA1
4
SW
5
SDA2
1 GND
002aab844
Fig 1.
Logic diagram of PCA9306 (positive logic)
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
5. Pinning information
5.1 Pinning
GND VREF1 SCL1 SDA1
1 2 3 4
002aab842
8 7
EN VREF2 SCL2 SDA2
GND VREF1 SCL1 SDA1
1 2 3 4
002aac373
8 7
EN VREF2 SCL2 SDA2
PCA9306DP1
6 5
PCA9306DP
6 5
Fig 2.
Pin configuration for TSSOP8 (DP1)
Fig 3.
Pin configuration for TSSOP8 (DP) (MSOP8)
VREF1 SCL1 SDA1 GND
1 2 3 4
002aac374
8
EN VREF2 SCL2 SDA2
GND VREF1 SCL1 SDA1
1 2 3 4
002aab843
8
EN VREF2 SCL2 SDA2
PCA9306DC
7 6 5
PCA9306DC1
7 6 5
Fig 4.
Pin configuration for VSSOP8 (DC)
Fig 5.
Pin configuration for VSSOP8 (DC1)
EN 1 8
terminal 1 index area GND
7
VREF2
PCA9306GM
VREF1 GND VREF1 SCL1 SDA1 1 2 8 7 EN VREF2 SCL2 SDA2 SCL1 3 4 5 SDA2 2 6 SCL2
PCA9306D
SDA1 3 4
002aac372
6 5
002aac375
Transparent top view
Fig 6.
Pin configuration for SO8
Fig 7.
Pin configuration for XQFN8
PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
4 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
GND VREF1 SCL1 SDA1
1 2
8 7
EN VREF2 SCL2 SDA2
GND VREF1 SCL1 SDA1
1 2 3 4
8 7 6 5
EN VREF2 SCL2 SDA2
PCA9306GD1
3 4 6 5
PCA9306GF
002aae014
002aaf393
Transparent top view
Transparent top view
Fig 8.
Pin configuration for XSON8U (GD1)
Fig 9.
Pin configuration for XSON8
5.2 Pin description
Table 2. Symbol Pin description Pin SO8, VSSOP8 (DC) TSSOP8 (MSOP8), TSSOP8, VSSOP8 (DC1), XQFN8, XSON8, XSON8U (GD1) GND VREF1 SCL1 SDA1 SDA2 SCL2 VREF2 EN 1 2 3 4 5 6 7 8 4 1 2 3 5 6 7 8 ground (0 V) low-voltage side reference supply voltage for SCL1 and SDA1 serial clock, low-voltage side; connect to VREF1 through a pull-up resistor serial data, low-voltage side; connect to VREF1 through a pull-up resistor serial data, high-voltage side; connect to VREF2 through a pull-up resistor serial clock, high-voltage side; connect to VREF2 through a pull-up resistor high-voltage side reference supply voltage for SCL2 and SDA2 switch enable input; connect to VREF2 and pull-up through a high resistor Description
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
5 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
6. Functional description
Refer to Figure 1 "Logic diagram of PCA9306 (positive logic)".
6.1 Function table
Table 3. Function selection (example) H = HIGH level; L = LOW level. Input EN[1] H L
[1]
Function SCL1 = SCL2; SDA1 = SDA2 disconnect
EN is controlled by the Vbias(ref)(2) logic levels and should be at least 1 V higher than Vref(1) for best translator operation.
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Over operating free-air temperature range. Symbol Vref(1) Vbias(ref)(2) VI VI/O Ich IIK Tstg
[1]
Parameter reference voltage (1) reference bias voltage (2) input voltage voltage on an input/output pin channel current (DC) input clamping current storage temperature
Conditions
Min -0.5 -0.5 -0.5[1] -0.5[1] -
Max +6 +6 +6 +6 128 -50 +150
Unit V V V V mA mA C
VI < 0 V
-65
The input and input/output negative voltage ratings may be exceeded if the input and input/output clamp current ratings are observed.
8. Recommended operating conditions
Table 5. Symbol VI/O Vref(1)[1] VI(EN) Isw(pass) Tamb
[1]
Operating conditions Parameter Conditions Min 0 0 0 0 operating in free-air -40 Max 5 5 5 5 64 +85 Unit V V V V mA C voltage on an input/output pin SCL1, SDA1, SCL2, SDA2 reference voltage (1) input voltage on pin EN pass switch current ambient temperature VREF1 VREF2
Vbias(ref)(2)[1] reference bias voltage (2)
Vref(1) Vbias(ref)(2) - 1 V for best results in level shifting applications.
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
6 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
9. Static characteristics
Table 6. Static characteristics Tamb = -40 C to +85 C, unless otherwise specified. Symbol VIK IIH Ci(EN) Cio(off) Cio(on) Ron Parameter input clamping voltage HIGH-level input current input capacitance on pin EN off-state input/output capacitance on-state input/output capacitance ON-state resistance[2] Conditions II = -18 mA; VI(EN) = 0 V VI = 5 V; VI(EN) = 0 V VI = 3 V or 0 V SCLn, SDAn; VO = 3 V or 0 V; VI(EN) = 0 V SCLn, SDAn; VO = 3 V or 0 V; VI(EN) = 3 V SCLn, SDAn; VI = 0 V; IO = 64 mA VI(EN) = 4.5 V VI(EN) = 3 V VI(EN) = 2.3 V VI(EN) = 1.5 V VI(EN) = 1.5 V VI = 2.4 V; IO = 15 mA VI(EN) = 4.5 V VI(EN) = 3 V VI = 1.7 V; IO = 15 mA VI(EN) = 2.3 V
[1] [2] [3] [4] All typical values are at Tamb = 25 C. Measured by the voltage drop between the SCL1 and SCL2, or SDA1 and SDA2 terminals at the indicated current through the switch. ON-state resistance is determined by the lowest voltage of the two terminals. Guaranteed by design. For DC and DC1 (VSSOP8) package only.
[4] [3]
Min -
Typ[1] 7.1 4 9.3
Max -1.2 5 6 12.5
Unit V A pF pF pF
-
2.4 3.0 3.8 9.0 32 4.8 46 40
5.0 6.0 8.0 20 80 7.5 80 80

PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
10. Dynamic characteristics
Table 7. Dynamic characteristics (translating down) Tamb = -40 C to +85 C, unless otherwise specified. Values guaranteed by design. Symbol Parameter Conditions CL = 50 pF Min VI(EN) = 3.3 V; VIH = 3.3 V; VIL = 0 V; VM = 1.15 V (see Figure 10) tPLH tPHL LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 0 0 2.0 2.0 0 0 1.2 1.5 0 0 0.6 0.75 ns ns Max CL = 30 pF Min Max CL = 15 pF Min Max Unit
VI(EN) = 2.5 V; VIH = 2.5 V; VIL = 0 V; VM = 0.75 V (see Figure 10) tPLH tPHL 0 0 2.0 2.5 0 0 1.2 1.5 0 0 0.6 0.75 ns ns
Table 8. Dynamic characteristics (translating up) Tamb = -40 C to +85 C, unless otherwise specified. Values guaranteed by design. Symbol Parameter Conditions CL = 50 pF Min tPLH tPHL LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 0 0 Max 1.75 2.75 CL = 30 pF Min 0 0 Max 1.0 1.65 CL = 15 pF Min 0 0 Max 0.5 0.8 ns ns Unit
VI(EN) = 3.3 V; VIH = 2.3 V; VIL = 0 V; VTT = 3.3 V; VM = 1.15 V; RL = 300 (see Figure 10)
VI(EN) = 2.5 V; VIH = 1.5 V; VIL = 0 V; VTT = 2.5 V; VM = 0.75 V; RL = 300 (see Figure 10) tPLH tPHL 0 0 1.75 3.3 0 0 1.0 2.0 0 0 0.5 1.0 ns ns
VIH VTT
RL
input
VM
VM VIL VOH
from output under test
CL
S1 S2 (open)
output
VM
VM VOL
002aab846
002aab845
a. Load circuit
S1 = translating up; S2 = translating down. CL includes probe and jig capacitance.
b. Timing diagram
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr 2 ns; tf 2 ns. The outputs are measured one at a time, with one transition per measurement.
Fig 10. Load circuit for outputs
PCA9306_5
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Product data sheet
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
11. Application information
Vpu(D) = 3.3 V(1)
200 k
Vref(1) = 1.8 V(1) VREF1 2
PCA9306
8 EN 7 VREF2
RPU
RPU
RPU
RPU
VCC SCL I2C-BUS MASTER SDA GND SCL1 3 SW 6 SCL2
VCC SCL I2C-BUS DEVICE SDA GND
SDA1
4
SW 1 GND
5
SDA2
002aab847
(1) The applied voltages at Vref(1) and Vpu(D) should be such that Vbias(ref)(2) is at least 1 V higher than Vref(1) for best translator operation.
Fig 11. Typical application circuit (switch always enabled)
3.3 V enable signal(1) on off
200 k
Vpu(D) = 3.3 V
Vref(1) = 1.8 V(1) VREF1 2
PCA9306
8 EN 7 VREF2
RPU
RPU
RPU
RPU
VCC SCL I2C-BUS MASTER SDA GND SCL1 3 SW 6 SCL2
VCC SCL I2C-BUS DEVICE SDA GND
SDA1
4
SW 1 GND
5
SDA2
002aab848
(1) In the Enabled mode, the applied enable voltage and the applied voltage at Vref(1) should be such that Vbias(ref)(2) is at least 1 V higher than Vref(1) for best translator operation.
Fig 12. Typical application circuit (switch enable control)
PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
9 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
11.1 Bidirectional translation
For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the EN input must be connected to VREF2 and both pins pulled to HIGH side Vpu(D) through a pull-up resistor (typically 200 k). This allows VREF2 to regulate the EN input. A filter capacitor on VREF2 is recommended. The I2C-bus master output can be totem-pole or open-drain (pull-up resistors may be required) and the I2C-bus device output can be totem-pole or open-drain (pull-up resistors are required to pull the SCL2 and SDA2 outputs to Vpu(D)). However, if either output is totem-pole, data must be unidirectional or the outputs must be 3-stateable and be controlled by some direction-control mechanism to prevent HIGH-to-LOW contentions in either direction. If both outputs are open-drain, no direction control is needed. The reference supply voltage (Vref(1)) is connected to the processor core power supply voltage. When VREF2 is connected through a 200 k resistor to a 3.3 V to 5.5 V Vpu(D) power supply, and Vref(1) is set between 1.0 V and (Vpu(D) - 1 V), the output of each SCL1 and SDA1 has a maximum output voltage equal to VREF1, and the output of each SCL2 and SDA2 has a maximum output voltage equal to Vpu(D).
Table 9. Application operating conditions Refer to Figure 11. Symbol Vbias(ref)(2) VI(EN) Vref(1) Isw(pass) Iref Tamb
[1]
Parameter reference bias voltage (2) input voltage on pin EN reference voltage (1) pass switch current reference current ambient temperature
Conditions
Min Vref(1) + 0.6 Vref(1) + 0.6 0 -
Typ[1] 2.1 2.1 1.5 14 5 -
Max 5 5 4.4 +85
Unit V V V mA A C
transistor operating in free-air
-40
All typical values are at Tamb = 25 C.
11.2 Sizing pull-up resistor
The pull-up resistor value needs to limit the current through the pass transistor when it is in the ON state to about 15 mA. This ensures a pass voltage of 260 mV to 350 mV. If the current through the pass transistor is higher than 15 mA, the pass voltage also is higher in the ON state. To set the current through each pass transistor at 15 mA, the pull-up resistor value is calculated as: V pu ( D ) - 0.35 V R PU = ------------------------------------0.015 A (1)
Table 10 summarizes resistor reference voltages and currents at 15 mA, 10 mA, and 3 mA. The resistor values shown in the +10 % column or a larger value should be used to ensure that the pass voltage of the transistor would be 350 mV or less. The external driver must be able to sink the total current from the resistors on both sides of the PCA9306 device at 0.175 V, although the 15 mA only applies to current flowing through the PCA9306 device.
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
10 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
Table 10. Pull-up resistor values Calculated for VOL = 0.35 V; assumes output driver VOL = 0.175 V at stated current. Vpu(D) 15 mA Nominal 5V 3.3 V 2.5 V 1.8 V 1.5 V 1.2 V
[1]
Pull-up resistor value () 10 mA Nominal 465 295 215 145 115 85 +10 %[1] 512 325 237 160 127 94 Nominal 1550 983 717 483 383 283 341 217 158 106 85 63 3 mA +10 %[1] 1705 1082 788 532 422 312 +10 %[1]
310 197 143 97 77 57
+10 % to compensate for VCC range and resistor tolerance.
11.2.1 Maximum frequency calculation
The maximum frequency is totally dependent upon the specifics of the application and the device can operate > 33 MHz. Basically, the PCA9306 behaves like a wire with the additional characteristics of transistor device physics and should be capable of performing at higher frequencies if used correctly. Here are some guidelines to follow that will help maximize the performance of the device:
* Keep trace length to a minimum by placing the PCA9306 close to the processor. * The trace length should be less than half the time of flight to reduce ringing and
reflections.
* The faster the edge of the signal, the higher the chance for ringing. * The higher the drive strength (up to 15 mA), the higher the frequency the device can
use. In a 3.3 V to 1.8 V direction level shift, if the 3.3 V side is being driven by a totem pole type driver no pull-up resistor is needed on the 3.3 V side. The capacitance and line length of concern is on the 1.8 V side since it is driven through the ON resistance of the PCA9306. If the line length on the 1.8 V side is long enough there can be a reflection at the chip/terminating end of the wire when the transition time is shorter than the time of flight of the wire because the PCA9306 looks like a high-impedance compared to the wire. If the wire is not too long and the lumped capacitance is not excessive the signal will only be slightly degraded by the series resistance added by passing through the PCA9306. If the lumped capacitance is large the rise time will deteriorate, the fall time is much less affected and if the rise time is slowed down too much the duty cycle of the clock will be degraded and at some point the clock will no longer be useful. So the principle design consideration is to minimize the wire length and the capacitance on the 1.8 V side for the clock path. A pull-up resistor on the 1.8 V side can also be used to trade a slower fall time for a faster rise time and can also reduce the overshoot in some cases.
PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
11.2.1.1
Example maximum frequency Question -- We need to make the PLL area of a new line card backwards compatible and need to need to convert one GTL signal to LVTTL, invert it, and convert it back to GTL. The signal we want to convert is random in nature but will mostly be around 19 MHz with very long periods of inactivity where either a HIGH or LOW state will be maintained. The traces are 1 or 2 inches long with trace capacitance of about 2 pF per inch. Answer -- The frequency of the PCA9306 is limited by the capacitance of the part, the capacitance of the traces and the pull-up resistors used. The limiting case is probably the LOW-to-HIGH transition in the GTL to LVTTL direction, and there the use of the lowest acceptable resistor values will minimize the rise time delay. Assuming 50 pF capacitance and 220 resistance, the RC time constant is 11 ns (50 pF x 220 ). With 19 MHz corresponding to 50 ns period the PCA9306 will support this application.
PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c
y
HE
vMA
Z
8 5
Q A2
pin 1 index
A1
(A 3) Lp L
A
1
4
e
bp
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75
0.069
A1 0.25 0.10
A2 1.45 1.25
A3 0.25
0.01
bp 0.49 0.36
c 0.25 0.19
D (1) 5.0 4.8
0.20 0.19
E (2) 4.0 3.8
0.16 0.15
e 1.27
0.05
HE 6.2 5.8
L 1.05
Lp 1.0 0.4
Q 0.7 0.6
v 0.25
0.01
w 0.25
0.01
y 0.1
0.004
Z (1) 0.7 0.3
0.028 0.012
8o o 0
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC
076E03
JEDEC
MS-012
JEITA
EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 13. Package outline SOT96-1 (SO8)
PCA9306_5 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
13 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18
Fig 14. Package outline SOT505-1 (TSSOP8)
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c y HE vMA
Z
8
5
A pin 1 index
A2 A1
(A3)
Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 8 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16
Fig 15. Package outline SOT505-2 (TSSOP8)
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Product data sheet
Rev. 05 -- 19 March 2010
15 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A X
c y HE vMA
Z
8
5
Q A pin 1 index A2 A1 (A3) Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 8 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION
ISSUE DATE 02-06-07
Fig 16. Package outline SOT765-1 (VSSOP8)
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
SOT902-1
D terminal 1 index area
B
A
E
A A1
detail X
L1 L
e
4
e v M C A B w M C
5
C y1 C y
3
metal area not for soldering
2 6
b
e1
e1
7 1
terminal 1 index area
8
X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 1.65 1.55 E 1.65 1.55 e 0.55 e1 0.5 L 0.35 0.25 L1 0.15 0.05 v 0.1 w 0.05 y 0.05 y1 0.05
OUTLINE VERSION SOT902-1
REFERENCES IEC --JEDEC MO-255 JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 05-11-25 07-11-14
Fig 17. Package outline SOT902-1 (XQFN8)
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm
E
SOT1089
terminal 1 index area
D
A A1
detail X
(4x)(2) e b (8x)(2) L4 5 e1
1 terminal 1 index area
8
b1 0 0.5 scale 1 mm
X
Dimensions Unit mm max nom min A(1) 0.5 A1 b b1 D E e e1 L
0.04 0.35 0.40 1.40 1.05 0.20 0.30 0.35 1.35 1.00 0.55 0.35 0.15 0.12 0.27 0.32 1.30 0.95
Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1089 References IEC JEDEC MO-252 JEITA European projection
sot1089_po
Issue date 09-04-10 09-10-22
Fig 18. Package outline SOT1089 (XSON8)
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Product data sheet
Rev. 05 -- 19 March 2010
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NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A1
detail X terminal 1 index area e1 L1
1
e
b
4
v w
M M
CAB C
C y1 C y
L2
L
8 5
X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT996-2
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-12-18 07-12-21
Fig 19. Package outline SOT996-2 (XSON8U)
PCA9306_5 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
19 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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Product data sheet
Rev. 05 -- 19 March 2010
20 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
13.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 20) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 11 and 12
Table 11. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 12. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 20.
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
21 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 20. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
14. Abbreviations
Table 13. Acronym CDM ESD HBM I2C-bus I/O MM PRR RC SMBus Abbreviations Description Charged-Device Model ElectroStatic Discharge Human Body Model Inter-Integrated Circuit bus Input/Output Machine Model Pulse Repetition Rate Resistor-Capacitor network System Management Bus
PCA9306_5
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Product data sheet
Rev. 05 -- 19 March 2010
22 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
15. Revision history
Table 14. Revision history Release date 20100319 Data sheet status Product data sheet Change notice Supersedes PCA9306_4 Document ID PCA9306_5 Modifications:
* *
Section 2 "Features": - added XSON8 and XSON8U packages to last bullet item Table 1 "Ordering information": - added "PCA9306GF" package option - added "PCA9306GD1" package option
* *
Section 5.1 "Pinning": added PCA9306GF and PCA9306GD1 pin configurations. Section 12 "Package outline": - added Figure 18 "Package outline SOT1089 (XSON8)" - added Figure 19 "Package outline SOT996-2 (XSON8U)"
PCA9306_4 PCA9306_3 PCA9306_2 PCA9306_1
20091026 20080804 20070221 20061020
Product data sheet Product data sheet Product data sheet Product data sheet
-
PCA9306_3 PCA9306_2 PCA9306_1 -
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
23 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the
(c) NXP B.V. 2010. All rights reserved.
16.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
PCA9306_5
Product data sheet
Rev. 05 -- 19 March 2010
24 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9306_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 19 March 2010
25 of 26
NXP Semiconductors
PCA9306
Dual bidirectional I2C-bus and SMBus voltage-level translator
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 6 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Recommended operating conditions. . . . . . . . 6 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Application information. . . . . . . . . . . . . . . . . . . 9 11.1 Bidirectional translation . . . . . . . . . . . . . . . . . 10 11.2 Sizing pull-up resistor . . . . . . . . . . . . . . . . . . . 10 11.2.1 Maximum frequency calculation . . . . . . . . . . . 11 11.2.1.1 Example maximum frequency . . . . . . . . . . . . 12 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Soldering of SMD packages . . . . . . . . . . . . . . 20 13.1 Introduction to soldering . . . . . . . . . . . . . . . . . 20 13.2 Wave and reflow soldering . . . . . . . . . . . . . . . 20 13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20 13.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 17 Contact information. . . . . . . . . . . . . . . . . . . . . 25 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 March 2010 Document identifier: PCA9306_5

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